| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve problems that connection is impaired due to a flux staying between molten solder paste and solder bumps even if the solder paste is completely melted because the upward warpage of a component occurs at an external periphery in reflow connection, and that Zn in Sn-Zn lead-free solder is oxidized by oxygen in atmospheric air during soldering and the wettability of the solder is not satisfactory for an electrode to be soldered or solder bumps, and this causes deterioration in connection strength. <P>SOLUTION: A mounting structure is provided which has a plurality of components each having a plurality of solder bumps, a substrate having a plurality of lands, and a solder connection portion for connecting the solder bumps to the lands. In the mounting structure, the lands formed at the external periphery of the substrate are smaller than the lands at the center of the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
