发明名称
摘要 A method and apparatus for imprinting substrates. One embodiment of the invention provides a microtool having a sidewall on one or both plates. The sidewalls help prevent excess dielectric material from forming on the microtool plates or the substrate. For one embodiment of the invention, each microtool plate has a sidewall formed thereon. Upon application of pressure, the sidewalls contact each other, thus reducing or eliminating flexing of the microtool plates.
申请公布号 JP2008509555(A) 申请公布日期 2008.03.27
申请号 JP20070524831 申请日期 2005.07.20
申请人 发明人
分类号 H05K3/22;H05K3/00;H05K3/46 主分类号 H05K3/22
代理机构 代理人
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