| 摘要 |
PROBLEM TO BE SOLVED: To form a highly rigid nozzle plate without thinning down a substrate, to reduce warpage in the vicinity of an ejection nozzle, and to precisely form the nozzle. SOLUTION: By using a substrate with a three-layer structure having an oxide film embedded between silicon substrates, a counterbore section is formed on one of the silicon substrates forming the three-layer structure by etching while using the embedded oxide film as an etch-stop layer. A taper section of the nozzle is formed on the silicon substrate by etching at a portion corresponding to the counterbore section on the silicon substrate opposite the silicon substrate having the formed counterbore section with the oxide film therebetween. A straight section of the nozzle is formed on the embedded oxide film by etching while using an identical mask which is used in the forming of the taper section. COPYRIGHT: (C)2008,JPO&INPIT
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