Chip i.e. semiconductor chip, coplanar installing method, involves connecting adhesive surfaces with each other by chip and support under adjusting of intermediate area between chip and support

摘要

The method involves attaching a number of adhesive surfaces that are spaced to each other, on a support (1) and/or on a side of a chip according to a pre-defined distribution. The number of adhesive surfaces is connected with each other by the chip and the support under adjusting of an intermediate area (11) between the chip and the support. Each adhesive surface is produced from a locally limited, hardenable adhesive storage in connection with an individually positioned spacer (6). An adhesive pad (5) is attached on the support and the chip based on adhesive surfaces distribution. An independent claim is also included for an arrangement for coplanar installing of a semiconductor chip on a support.