| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that is excellent in workability during maintenance and that has high flexibility to arrange processing units. SOLUTION: A unit arrangement portion 10 includes: a chemical cabinet 11 arranged in the lowermost part thereof; application processing units SC1 and SC2 that form a resist film to a substrate as a liquid processing unit, and development units SD1 and SD2 that perform processing procedure to the exposed substrate, wherein these units SC1, SC2, SD1 and SD2 are each arranged on the upper of the chemical cabinet 11 and in respective four corners of the apparatus as liquid processing units; multiple stage heat treatment units 20 for heat-treating the substrate further arranged on the upper of these liquid processing units and in the front or rear of the apparatus; and a cleaning process unit SS for supplying a cleaning solution such as a purified water to the substrate to clean the substrate as a substrate processing unit, the unit SS being arranged in the front side of the apparatus and between the application processing units SC1 and SC2. COPYRIGHT: (C)2008,JPO&INPIT
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