| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package structure and its manufacturing method. SOLUTION: This semiconductor package structure and its manufacturing method comprise a wire frame 20, at least one chip 40, at least one controlling element 30, and at least one passive element 70. The chip and controlling element are mounted on the mounting base 26 of the wire frame, while a forming material 50 covers the wire frame, chip and controlling element, and forms a package object 10. The forming material installs at least one concave barrel 60, and the depth of the concave barrel is reached to the surface of the mounting base of the wire frame. The passive element is electrically connected to the wire frame inside the concave barrel. COPYRIGHT: (C)2008,JPO&INPIT
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