| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable mounting structure of semiconductor devices by suppressing open-circuit failures at the outer peripheral part of a package which are easy to occur when a lead-free solder is used, by applying a simple modification to the layout or the like of an electrode on a circuit wiring board. SOLUTION: In the mounting structure of a semiconductor device, a lead-free solder bump 16 is interposed between an electrode 15 of a package type semiconductor device 14 and an electrode 12 of a circuit wiring board 11, to connect them each other. Relating to an alignment bump 17 provided at any one point within a mounting area of the semiconductor device 14, with at least a single point near the center being preferred, and an electrode 12 of the wiring circuit board 11 connected to correspond to the electrodes 15 of the semiconductor device 14, an electrode arrangement pattern is selected and formed in advance so that the center coordinate of each electrode 12 almost agrees with the center coordinate of each electrode 15 of the semiconductor device 14 when heated, for solder reflow connection, and reaches a solder solidification point. COPYRIGHT: (C)2008,JPO&INPIT
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