| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which eliminates the cost escalation with a simple forming method in forming a copper post etc. in a semiconductor wafer level CSP package, and the cost escalation of photosensitive interlayer insulating film in forming a laminated circuit of semiconductor. SOLUTION: A sealing resin 5 is coated on a semiconductor chip 7 by an inkjet method and at the same time the formation of an opening 4 is carried out, and by bonding directly an external terminal 6 to the opened portion, a low cost semiconductor wafer level CSP package in which the material to serve as the copper post and the forming process are saved is obtained. Moreover, in the formation of a vertical conductive interconnection on the laminated circuit formation of the semiconductor, an insulating film layer between the vertical interconnection is coated by the inkjet method, and at the same time, the formation of the opening is carried out. In the opened portion, a lower interconnection and an upper interconnection are formed to make the vertical conductive interconnection, thereby the manufacturing method of a cheap interlayer insulating film is obtained. COPYRIGHT: (C)2008,JPO&INPIT
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