STRESSED ORGANIC SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a stressed organic semiconductor device capable of using mechanical force for effectively improving or reducing the mobility of charged carriers in an organic semiconductor material. SOLUTION: The organic semiconductor device 100 comprises: a substrate 106 having a first thermal expansion coefficient; and the organic semiconductor material 102 coupled to the substrate 106 at an interface 110 therebetween. The organic semiconductor material 102 includes a polymer-based organic semiconductor material and/or an oligomer-based organic semiconductor material. The organic semiconductor material 102 also has a second thermal expansion coefficient that is different from the first thermal expansion coefficient, such that a mechanical stress is transferred from the substrate 106 to the organic semiconductor material 102 through the interface 110. The mechanical force is related to the difference between the first and second thermal expansion coefficients, and a change in the temperature of the organic semiconductor device 100, and changes at least the partial carrier mobility of the organic semiconductor material 102. COPYRIGHT: (C)2008,JPO&INPIT