| 摘要 |
The interposer includes a glass substrate 46 with first through-electrodes 47 buried in; a plurality of resin layers 68, 20, 32 supported by the glass substrate; thin film capacitors 18 a , 18 b buried between a first resin layer 68 of the plural resin layers and a second resin layer 20 of the plural resin layers and including the first capacitor electrodes 12 a , 12 b, the second capacitor electrodes 16 opposed to the first capacitor electrodes 12 a , 12 b, and a dielectric thin film 14 of a relative dielectric constant of 200 or above formed between the first capacitor electrode 12 a , 12 b and the second capacitor electrode 16 , and the second through-electrodes 77 a , 77 b penetrating the plural resin layers 68, 20, 32 , electrically connected to the first through-electrode 47 and electrically connected to the first capacitor electrode 12 a , 12 b or the second capacitor electrode 16.
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