发明名称 MULTI LAYER CHIP CAPACITOR AND MANUFACTURING METHOD AND APPARATUS THEREFOR
摘要 The present invention carries out the vacuum deposition by setting a deposition angle between a single mask set including a shadow mask having a plurality of slits and a deposition source to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once, or adjusts slit patterns by relatively moving upper and lower mask sets that respectively include shadow masks having a plurality of slits and face each other to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once.
申请公布号 KR100817174(B1) 申请公布日期 2008.03.27
申请号 KR20060055074 申请日期 2006.06.19
申请人 发明人
分类号 H01G4/228;H01G4/018 主分类号 H01G4/228
代理机构 代理人
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