| 发明名称 |
PRE-CURING ADHESIVE FILM COMPOSITION FOR ASSEMBLING SEMICONDUCTOR |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive film for assembling a semiconductor which contains a pre-curing additive and thus has improved tensile strength so that it can be used in a semiconductor manufacturing process to improve the success rate for pick up of a chip and reduce the chance for bubbling, thereby to provide secured high reliability and excellent processability. <P>SOLUTION: The method for manufacturing the adhesive film composition for assembling a semiconductor comprises an elastomer resin having a hydroxy group, a carboxy group or an epoxy group; a film-forming resin having a glass transition temperature (Tg) of -10-200°C; an epoxy resin; a phenol-base curing agent; a curing catalyst; a pre-curing additive; a silane coupling agent; and a filler. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
| 申请公布号 |
JP2008069352(A) |
申请公布日期 |
2008.03.27 |
| 申请号 |
JP20070235312 |
申请日期 |
2007.09.11 |
| 申请人 |
CHEIL INDUSTRIES INC |
发明人 |
JUNG KI SUNG;KIM WAN JUNG;HONG YONG WOO;JEONG CHUL;CHANG BUM CHUNG |
| 分类号 |
C09J201/06;C09J7/00;C09J11/04;C09J11/06;C09J109/00;C09J161/04;C09J163/00;C09J171/10;C09J175/04;H01L21/52 |
主分类号 |
C09J201/06 |
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