WAFER MACHINING METHOD AND APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a wafer machining method and apparatus, capable of efficiently machining a wafer without generating any crack therein by using laser beams, and efficiently removing fused deposits generated due to the machining without any adverse effect thereon with a simple constitution.

SOLUTION: The wafer machining method for machining a wafer 1 containing silicon by laser beams 2 comprises a laser beam machining step of machining the wafer 1 by applying the laser beams 2 to the wafer, and a plasma applying step of applying atmospheric plasma 5 containing fluorine-based gas to a part to be machined by the laser beams 2.

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