| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a process and apparatus for efficiently joining many joining parts in at least two elements, in particular an electronic component such as an LED with a substrate, such as a PCB. <P>SOLUTION: An imaging means divides a light beam 10 using a diffractive optical element (DOE) 5 also enabling essentially desired beam shaping and beam processing, and images these partial divided light beams, forming a plurality of discrete light spots, which form a plurality of discrete material joining portions 14a, 14b... A plurality of material joining portions can be formed simultaneously enabling a high process rate. Thus, the method is suited for laser soldering of components. These discrete light spots can also be used for material processing, in particular for simultaneously forming a plurality of preweakened material zones or perforations in a substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
