| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure which can reduce the chip size of a semiconductor chip mounted with integrated circuits requiring large-capacity capacitors. <P>SOLUTION: The semiconductor device has a semiconductor chip 1 having an element forming region and a peripheral region so formed as to surround the element forming region, and has a plurality of metal rings 12 (121-123) which are formed in forms of concentric circles at the peripheral region of the semiconductor chip 1 and are formed by laminating a plurality of metal layers. Further, each pair of the metal rings 12 which are adjacent to each other constitutes a capacitor having a predetermined potential difference as a pair of electrodes opposed to each other. Because the metal rings not used conventionally for constituting the circuit of the semiconductor device but used for improving its reliability are utilized as a metal capacitor, the chip size of its semiconductor chip mounted with semiconductor integrated circuits requiring large-capacity capacitors can be made small. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
