| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for mounting an electronic part that enables simple and easy soldering of an electronic part onto a metal substrate as well as upgrading efficiency and improving reliability of soldering work. SOLUTION: A metal substrate 2 is arranged on a uniform heater plate 3, and a paste solder 4 is applied to a place where an electronic part 1 is to be soldered on the metal substrate 2. A hot plate 5 is pressed to the lower surface of the uniform heater plate 3 from beneath, and the metal substrate 2 and the paste solder 4 are indirectly heated through the uniform heater plate 3, thus melting the paste solder 4 applied onto the metal substrate 2. An electrode portion 1a provided on the electronic part 1 and the paste solder 4 applied on the metal substrate 2's wiring pattern 2a are faced, the electronic part 1 is once placed onto the paste solder 4, and then, the electronic part 1 is slightly moved up and down, thus soldering the electronic part 1's electrode 1a to the metal substrate 2's wiring pattern 2a. COPYRIGHT: (C)2008,JPO&INPIT
|
