发明名称 METHOD AND APPARATUS OF MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To soak a material to be processed while preventing air bubbles from being attached to the material. SOLUTION: A target 10 including a substrate having a through hole and a metallic foil stuck to a first surface 21 of the substrate to close the through hole to make wiring is soaked in a process liquid 20. Before soaking the target 10 in the process liquid 20, the liquid 20 is supplied to a second surface 22 opposite to the first surface 21 of the substrate to reserve the liquid 20 in the through hole closed by the metallic foil. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008071884(A) 申请公布日期 2008.03.27
申请号 JP20060248325 申请日期 2006.09.13
申请人 SEIKO EPSON CORP 发明人 CHIBA TOSHIKI
分类号 H05K3/26 主分类号 H05K3/26
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