| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition method which can deposit a film dein accordance with surface conditions of a substrate in an aerosol deposition process, and is excellent in a film deposition rate and a film deposition efficiency. SOLUTION: The film deposition method is provided with: an aerosol deposition stage where particulates are dispersed into a gas, so as to form an aerosol; and a film deposition stage where the aerosol is jetted to the polished surface of a substrate from an aerosol jet nozzle in a vacuum chamber. In the film deposition stage, while relatively moving the aerosol jet nozzle and the substrate as a prescribed distance is retained, the aerosol is jetted from the aerosol jet nozzle to the surface of the substrate, so as to be collided thereagainst. The direction of the above movement (film deposition direction) is the one controlled to the range of 0°±20°or 90°±20°at a relative angle with the surface polishing direction in the substrate (B in figure). COPYRIGHT: (C)2008,JPO&INPIT
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