| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the thickness of a semiconductor device and to suppress a decline in manufacturing yield of the same. <P>SOLUTION: The semiconductor device 100 comprises a package substrate 101, a first semiconductor chip 103 flip-bonded on a chip mounting face of the package substrate 101, an underfil resin 105 which substantially covers the whole surface of the chip mounting face of the package substrate 101 including the first semiconductor chip 103 mounted region, and a peripheral layer 107. A rear face of a face of the first semiconductor chip 103 facing the package substrate 101 is not covered by the peripheral layer 107. <P>COPYRIGHT: (C)2008,JPO&INPIT |
