| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package protection member which can solve a problem of low light transmission rates of conventional chip package structures. <P>SOLUTION: A chip package structure 300 comprises a chip 310, a package protection member 320, and an adhesive layer 330. The chip 310 has an operation surface 312. An image detection device 314 is positioned on the operation surface 312, and multiple contact pads 316 are positioned around the image detection device 314. The package protection member 320 is positioned on the operation surface 312. The package protection member 320 has a substrate 322 and a supporting portion 324 above the substrate 322, in which a hollow space S over the substrate 322 is delimited by the supporting portion 324. The supporting portion 324 may be in contact with the operation surface 312 so that the image detection device 314 on the operation surface 312 is located in the hollow space S. The adhesive layer 330 is positioned between the supporting portion 324 and the operation surface 312. <P>COPYRIGHT: (C)2008,JPO&INPIT |
