| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sheet cutting device and cutting method, preventing the occurrence of damage, breakage and the like to a plate-like member, and cutting a sheet according to a size of the plate-like member. <P>SOLUTION: This sheet cutting device 18 includes: first and second tables 13A, 13B supporting semiconductor wafers W different in size; and a robot 17 having a cutter blade 16 for cutting a sheet S stuck to the wafer according to the size of the wafer. The first and second tables is capable of moving to selectively locate to a sheet cutting reference position P, and a chuck 109 of the robot grasps an engagement part 56 on the table side to thereby perform the movement. The tables respectively include: outside tables 51A, 51B; and inside tables 52A, 52B substantially corresponding to the sizes of the wafers, wherein a clearance gap C for receiving the tip side of the cutter blade is formed between the outside table and the inside table. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
