| 摘要 |
PROBLEM TO BE SOLVED: To make the division of a wafer possible surely along its predetermined dividing line subjected to division-starting-point processing, even when the absorbing area of the line absorbing portion of a wafer dividing apparatus is relatively small. SOLUTION: Facing a line absorbing portions 52 for absorbing supportingly the side portions of a predetermined dividing line 102 of a wafer 1 in a way that it interposes the line 102, a pressing portion 551 for pressing the side portion of the predetermined dividing line 102. Thereby, even when the absorbing area of the line absorbing portion 52 is relatively small, the side portion of the predetermined dividing line 102 of the wafer 1 can be supported in an interposing way by the line absorbing portion 52 and the pressing portion 551, and moreover, the division of the wafer 1 is made possible surely along its predetermined dividing line 102 subjected to division-starting-point processing. COPYRIGHT: (C)2008,JPO&INPIT |
