发明名称 |
METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION |
摘要 |
A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting the bond pads to the Ni/Au pad metallization.
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申请公布号 |
US2008073790(A1) |
申请公布日期 |
2008.03.27 |
申请号 |
US20070866741 |
申请日期 |
2007.10.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BURRELL LLOYD G.;DAVIS CHARLES R.;GOLDBLATT RONALD D.;LANDERS WILLIAM F.;MEHTA SANJAY C. |
分类号 |
H01L23/48;H01L21/44;H01L23/31;H01L23/485;H01L23/532 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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