| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate which suppresses the occurrence of breakage of a low melting point brazing material and a connecting pad by the progress of crack generated from the outer rim of a region which is not covered by an insulating film. SOLUTION: The wiring substrate is constituted of a wiring conductor 2 formed in an insulating substrate 1, a connecting pad 6 provided on the lower surface of the insulating substrate 1 so as to be connected to the wiring conductor 2 and an insulating film 8 covering a region from the insulating substrate 1 around the connecting pad 6 to a region approximated to the peripheral rim of lower surface of the connecting pad 6. In this case, the connecting pad 6 is constituted of a flat plate shape connecting a pad main body 61 and a projected part 62 formed on the upper surface side so as to be opposed to the outer rim of the region not covered by the insulating film on the lower surface side of the connecting pad 61 while the projected part 62 is buried in the insulating substrate 1. COPYRIGHT: (C)2008,JPO&INPIT |
