| 摘要 |
PROBLEM TO BE SOLVED: To easily and properly judge the causal relation of a film forming process with film thickness irregularity when the flaw of the film thickness irregularity is detected. SOLUTION: In the inspection part 200 of this irregularity inspection device, streak irregularity, partial irregularity and spot irregularity are detected in the target image acquired from a substrate and the film on the substrate is inspected by a film inspection part 213 on the basis of the evaluation score related to the film thickness irregularity of the film on the substrate calculated by an evaluation score acquiring part 211. Succeedingly, the average evaluation scores related to the films on a predetermined number of substrates before the substrate concerned by an average evaluation score acquiring part 214 and the separation degree showing the ratio of the evaluation score of the film on the substrate is calculated with respect to the average evaluation score by a process inspection part 215. Then, the film forming process is inspected by the film inspection part 215 on the basis of the evaluation score of the substrate and the separation degree. By this constitution, when the flaw related to the film thickness irregularity in one substrate is detected, the causal relation of the film forming process with the film thickness irregularity can be judged easily and properly. COPYRIGHT: (C)2008,JPO&INPIT
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