发明名称 |
INTEGRATED MEMS PACKAGING |
摘要 |
<p>The microelectromechanical system (MEMS) package includes a substrate onto which is disposed or otherwise formed an active MEMS device, a cap for hermetically sealing the MEMS package and a pair of barrier walls for preventing bonding material for the cap from contaminating unintended areas of the substrate.</p> |
申请公布号 |
WO2008034233(A1) |
申请公布日期 |
2008.03.27 |
申请号 |
WO2007CA01660 |
申请日期 |
2007.09.18 |
申请人 |
SIMPLER NETWORKS, INC.;LU, JUN;MENARD, STEPHANE |
发明人 |
LU, JUN;MENARD, STEPHANE |
分类号 |
B81B7/02;B81C99/00 |
主分类号 |
B81B7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|