ADHESIVE FOR MOUNTING ELECTRONIC PART, METHOD FOR PRODUCING ADHESIVE FOR MOUNTING ELECTRONIC PART, ELECTRONIC PART MOUNTED STRUCTURE AND METHOD FOR PRODUCING ELECTRONIC PART MOUNTED STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive for mounting an electronic part effective for decreasing the generation of short circuit of an electronic part mounted structure obtained by bonding electronic parts and improving the bonding reliability between electrodes, a method for producing an adhesive for mounting electronic part, an electronic part mounted structure and a method for producing an electronic part mounted structure.

SOLUTION: In the electronic part mounted structure 10, the first circuit board 11 is bonded to the second circuit board 13 with an adhesive 20 for mounting an electronic part. The adhesive 20 for mounting electronic parts is produced by dispersing solder particles 22 in a thermosetting resin 21 provided that the solder particles 22 are heat-treated in an oxygen-containing atmosphere before dispersing in the thermosetting resin 21. The electrode 12 of the first circuit board 11 is electrically connected to the electrode 14 of the second circuit board through the solder particle 22 sandwiched between these electrodes 12, 14 to break the surface oxide layer 22a.

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