| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for handling an article in the course of semiconductor fabrication with which the risk of contamination caused by handling an article is low, or at least significantly reduced in comparison with previous handling methods. <P>SOLUTION: The invention relates in particular to the method for handling an article using a gripper 10 in the course of the semiconductor fabrication. When handling the article, the gripper is completely separated from the article by a frozen liquid and thus, direct contact between the gripper and the article is avoided. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
