GUARD STRUCTURE IN SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A guard structure of a semiconductor device is provided to prevent external moisture from penetrating into a chip by including a guard structure including a first guard composed of first and second sub guards and a second guard covering the first guard. A first guard includes first sub guards of a fence shape and second sub guards of a fence shape. The first sub guards are discontinuously formed in the periphery of a chip region of a semiconductor substrate. The second sub guards are discontinuously disposed in the periphery of the first sub guard. A second guard(29) of a plate shape is disposed on the first guard, covering the first guard. Third sub guards of a fence shape can be discontinuously disposed in the periphery of the second sub guard.