| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology capable of improving the reliability of hydrophobing treatment. <P>SOLUTION: The bydrophobing treatment device of this invention is provided with a chamber 10 and a satge 11 installed in the chamber 10. In this case, a semiconductor wafer W is arranged on the stage 11. On the other hand, a tank 13 is connected to the chamber 10 through a piping 12. In the tank 13, HMDS 15, supplied from an HMDS supplying unit 14, is stored. The HMDS 15 is agitated by a circulation pump 17a. Nitrogen gas is introduced into the tank 13 from a nitrogen gas introducing unit 16 and the introduced nitrogen gas is blown against the level of the HMDS 15. Vaporized HMDS 15 is sent into the chamber 10 by pressure by the nitrogen gas. <P>COPYRIGHT: (C)2008,JPO&INPIT |
