CHEMICAL AND METHOD FOR TREATING SUBSTRATE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a substrate treating method capable of smoothly performing second development treatment and thereon to an organic film pattern and so on, and a chemical used therefor. SOLUTION: An inhibiting layer composed of at least one of a transformed layer where the surface of the organic film pattern 4 is transformed and a deposited layer where depositions are deposited on the surface of the organic film pattern on the surface of the organic film pattern 4 on the substrate 1. In this case, the chemical is used for at least a removal treatment that removes the inhibiting layer and is an aqueous solution containing a first component composed of at least one of a hydroxylamine derivative and a hydrazine derivative and a developer component. COPYRIGHT: (C)2008,JPO&INPIT