| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can judge whether or not a probe is properly in contact with a pad of the semiconductor device without preventing the multi-pinning and pinch-pitching, and its inspection method as well as an inspection method for an inspecting device of the semiconductor device. SOLUTION: The semiconductor device has alignment pads 4 and 6 composed of multiple rectangular pads lined up in series in directions longitudinal and lateral to an LSI chip 2 in respective lengthwise and crosswise directions of the LSI chip 2 and arranged in a semiconductor wafer 1's dicing-line region 8 near the LSI chip 2, and inspection pads 5 and 7 formed for alignment positions detection such that they pair with the alignment pads 4 and 6, wherein the alignment pads 4 and 6 and the detection pads 5 and 7 twin to them are electrically connected through metal wiring formed on the semiconductor wafer 1. COPYRIGHT: (C)2008,JPO&INPIT
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