| 摘要 |
A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector ( 1 ) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins ( 2 ), installed in an insulator ( 3 ), each mechanical pin is topped with conductive elastromeric compound ( 4 ). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem(R), Polyimide, Torlon(R). Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.
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