发明名称 COOLING APPARATUS
摘要 A cooling apparatus is provided with a heat receiving section, which is arranged on a device to be cooled, in a substantially vertical direction to a substrate by having one of the two planes of the substrate whereupon the device is placed at the top and the other plane at the bottom, and exchanges heat between the device; a columnar section vertically standing on the substrate; a base which has a through hole wherein the columnar section is penetrated and is arranged on the heat receiving section; and a urging means for pressing the heat receiving section to the device to be cooled by urging the base along the columnar section.
申请公布号 WO2008035579(A1) 申请公布日期 2008.03.27
申请号 WO2007JP67557 申请日期 2007.09.04
申请人 NEC CORPORATION;YOSHIKAWA, MINORU 发明人 YOSHIKAWA, MINORU
分类号 H01L23/473 主分类号 H01L23/473
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