| 摘要 |
<P>PROBLEM TO BE SOLVED: To conduct lid mounting optimized for an electronic device and a carrier that optimizes heat dissipation and electromagnetic interference shielding. <P>SOLUTION: Optimized lid mounting for an electronic device and a carrier which uses standard manufacturing process steps of semiconductor packaging, and optimizes heat dissipation and electromagnetic interference shielding is disclosed. According to the present invention, conductive blocks or springs are soldered to ground pads of the chip carrier on rear surfaces thereof. On other surfaces, these conductive blocks or springs are electrically connected to a lid using a conductive adhesive material such as a silicone based material. Further, the lid is thermally connected to the semiconductor chip by an electrically insulating adhesive material. <P>COPYRIGHT: (C)2008,JPO&INPIT |
