| 摘要 |
<P>PROBLEM TO BE SOLVED: To supply an underfill material so that it does not come upon a semiconductor chip. <P>SOLUTION: A nozzle 32 is moved around a semiconductor chip 10 bonded to a wiring board 20 with its face facing downward, the underfill material is continuously supplied from the nozzle 32, and the material is filled between the wiring board 20 and the semiconductor chip 10. An outline of opposite faces of the chip 10 and the board 20 is a polygon consisting of a plurality of sides. A movement trace of the nozzle 32 includes a continuum of a linear trace 40 extending in a range of a pair of line segments L and L drawn at the right angle from both ends of a side and a turning trace 50 for changing the direction to connect adjacent linear traces 40. The nozzle 32 is more rapidly moved in the turning trace 50 than in the linear trace 40. <P>COPYRIGHT: (C)2008,JPO&INPIT |
