| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser processing method capable of highly accurately cutting an object to be processed along a line to cut irrespective of the thickness or the cleavage characteristic of the object. <P>SOLUTION: An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5 so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region positioned between the modified region M1 and the modified region M2 is formed within the object 1. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
