CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD USING THE SAME AND SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a ceramic substrate in which crack is hardly caused or developed in a heating-cooling cycle and having excellent durability, a ceramic circuit board using the same and a semiconductor module.

SOLUTION: The ceramic substrate has ≥6.0 MPa m1/2fracture toughness and ≥230 GPa bending modulus. The bending modulus is controlled to ≥230 GPa by controlling the Picker's hardness of the surface of the ceramic substrate to ≥1600. Otherwise, the bending modulus is controlled to ≥ 230 GPa by controlling residual stress of the surface of the ceramic substrate to ≤-40 MPa.

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