| 摘要 |
PROBLEM TO BE SOLVED: To enable smooth shift among steps and enable increase in a productivity and a yield by securing a stiffness of a wafer before cutting into individual devices and after thinning and facilitating handling of the thin wafer upon manufacture of such a device as a semiconductor chip having a through electrode. SOLUTION: A plurality of bumps 7 on the surface of a wafer 1 are made to have an identical height, a protective tape 10 is adhered on the surface of the wafer 1, and only a region of a rear surface of the wafer 1 corresponding to a device formation region 4 is made thin by grinding to form a recess 12 in the rear surface of the wafer and an annular extrusion 13 around the recess 12. The recess 12 is then etched to remove a mechanical damage, and metallic electrodes 8 are extruded from a bottom surface 12a of the recess 12 to form rear-surface-side electrodes 11. Thereafter the wafer 1 is divided into individual semiconductor chips 3. COPYRIGHT: (C)2008,JPO&INPIT
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