| 摘要 |
One embodiment of the invention is a semiconductor device ( 500 ) with a first ( 500 a) and a second ( 500 b) surface, a package including a plastic molding compound ( 501 ), and a semiconductor chip ( 502 ) inside the package. A first metal sheet ( 510, 401 ) covers at least portions of the first package surface ( 500 a), has a thickness ( 510 a, 401 a), and is preferably made of copper to operate as a heat spreader. At least one metal connector ( 511, 402 ) is in contact with the sheet, has the same thickness as the sheet, and is shaped to be operable as a mechanical spring between sheet and chip. An opening ( 512, 404 ) in the sheet is located adjacent to the connector and filled with molding compound. A second metal sheet ( 520 ) covers at least portions of the second package surface ( 500 b) and is connected to the chip.
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