发明名称 PLATING SOLUTION OF PALLADIUM ALLOY AND METHOD FOR PLATING USING THE SAME
摘要 The present invention relates to a plating solution of palladium alloy and has an object to provide a plating solution of palladium alloy highly stable and capable of stably forming a plated film of a given alloy composition. The present invention relates to a plating solution of palladium alloy containing a palladium complex and a metal salt, wherein the palladium complex is coordinated with at least one neutral amino acid selected from the group consisting of glycine, alanine, valine, leucine, serine, threonine, asparagine, glutamine and tyrosine as a ligand.
申请公布号 CA2604421(A1) 申请公布日期 2008.03.26
申请号 CA20072604421 申请日期 2007.09.26
申请人 TANAKA KIKINZOKU KOGYO K.K. 发明人 ISHIKAWA, TOMOKO;KITADA, KATSUTSUGU
分类号 C25D3/56;B01D53/22;B01D67/00;C01B3/56;C25D3/52 主分类号 C25D3/56
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