| 摘要 |
<p>A fusible I/O interconnection system and a method for flip-chip packaging involving a substrate-mounted stud bump are provided to obtain a precision mutual connection pitch by removing a bulky solder. A method for connecting electrically I/O bond-pads of a chip with I/O bond-pads(50) of a substrate(42) includes a process for forming each of stud-bumps(52) at the I/O bond-pads of the substrate. The method includes a process for flipping the chip and positioning the chip at the stud-bumps, to connect electrically the I/O bond-pads of the chip to the corresponding I/O bond-pads of the substrate. The I/O bond-pads of the chip are attached to the stud-bumps to connect electrically the stud-bumps to the I/O bond-pads of the chip.</p> |
