| 摘要 |
The invention relates to an arrangement comprising at least two different electronic semiconductor circuits (HS) in which each of the semiconductor circuits (HS) is a component made of semiconductor material and which has an electrically active surface and electronic contacts, and corresponding contacts of the semiconductor circuits are connected to one another in an electrically conductive manner. In order to simplify production, the semiconductor circuits (HS) are produced in a common support ( 12 ) made of semiconductor material and are connected to one another in an electrically conductive manner. Electrically conductive contacts ( 18 ) that are connected to the semiconductor circuits (HS) are produced on the surface of the support ( 12 ) by metallizing the support. Said support ( 12 ) has an expansion ( 13 ), which is made of the same material, forming a unit with the same, and which is provided for accommodating additional switching elements or components. |
