| 摘要 |
<p>Disclosed is a highly reliable material for flexible printed wiring boards which enables fine wiring. Specifically disclosed are a compound represented by the general formula (I) below, and a resin composition containing such a compound as a reactive monomer. (I) (In the formula, one of X and Y represents =O and the other represents =NAr2 R2; and R1, R2, Ar1 and Ar2 are as defined in the description.) ® KIPO & WIPO 2008</p> |
