IC SOCKET AND IC SOCKET ASSEMBLY

摘要

The present invention relates to an IC socket and the like for an IC package having plural electrical contacts arranged on the bottom face. The IC socket includes contacts arranged thereon at high density. The IC socket includes: an insulating housing 11 that accepts an IC package 50 on a bottom face of which plural electrical contacts 55 are arranged; plural elastic contacts 112 each one end of which is fixed to the insulating housing 11, and each other end of which contacts and keeps electrical contact with the electrical contact 55 on an bottom face of the IC package 50 accepted; and a spring member 113 that determines an accepting position where the IC package 50 is accepted in the insulating housing 11, and that restrains an amount of horizontal movement of the IC package 50, the horizontal movement caused by bending of the elastic contact 112 as the IC package 50 accepted is pressed down.