发明名称 |
METHOD FOR FABRICATING DEVICE CHIPS FROM THIN SHEET OF PYROELECTRIC MATERIAL |
摘要 |
A method of producing plural device chips from a thin plate of a pyroelectric material comprises the following steps. First, plural device-forming regions each having an electrode and a circuit pattern for electrically connecting the electrodes are formed on each of front and rear surfaces of the thin plate to obtain a device substrate. By making an electrical connection between the circuit patterns, and grounding it, all of the device-forming regions on the device substrate are at the same potential. Next, a blast treatment is performed to the device substrate to remove a required region of the pyroelectric material, while leaving a bridge portion extending between adjacent device-forming regions and having the circuit patterns thereon, so that a device-chip aggregate is formed, in which adjacent device chips are coupled through the bridge portion. Subsequently, by removing the bridge portion, the device chip is separated from the device-chip aggregate. <IMAGE> |
申请公布号 |
EP1178524(A4) |
申请公布日期 |
2008.03.26 |
申请号 |
EP20000987690 |
申请日期 |
2000.12.21 |
申请人 |
MATSUSHITA ELECTRIC WORKS, LTD. |
发明人 |
NISHIMURA, MAKOTO;KIMURA, KENICHI;MIYAGAWA, NOBUYUKI;KAWASHIMA, MASATO;NAKAMURA, YOSHIMITSU;IKARI, MOTOO;TAKADA, YUJI;TANIGUCHI, RYO |
分类号 |
H01L21/301;H01L37/02;(IPC1-7):H01L21/301;H01L27/14;H01L35/32 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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