| 摘要 |
<p>A method of producing TAB tape carrier that can produce TAB tape carrier in such a way as to prevent undulation at a split end surface thereof and tear of circuit pattern thereat, thereby producing the TAB tape carrier of high reliability with increased efficiency. In the method, an insulating layer 2 is formed on an elongate metal supporting layer 1 by application of resin solution to the metal supporting layer 1 and by drying, first. Then, a plurality of lines of wiring patterns 3 are formed on the insulating layer 2 in a semi-additive process. Thereafter, slit grooves S are formed in the metal supporting layer 1 in spaces between adjacent lines of wiring patterns 3. Then, the insulating layer 2 is split along the slit grooves S to divide the continuous sheet into individual strips, thereby producing the TAB tape carriers 12.</p> |
