发明名称 |
Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls |
摘要 |
A microelectronic structure having a substrate of multiple conductive bumps for contact with bond pads on an electronic substrate in the fabrication of a flip chip electronic assembly. Each of the conductive bumps includes a conductive layer which is absent from at least one sidewall of the bump to prevent the inadvertent formation of a short-circuiting electrical path between adjacent conductive bumps in the electronic assembly.
|
申请公布号 |
US7348271(B2) |
申请公布日期 |
2008.03.25 |
申请号 |
US20060644184 |
申请日期 |
2006.12.22 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HUANG YUAN-CHANG;CHANG SHYH-MING;LU SU-CHIA |
分类号 |
H01L29/12;H01L21/44;H01L21/60;H01L23/48;H01L23/485 |
主分类号 |
H01L29/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|