ADHESIVE TAPE CUTTING METHOD AND ADHESIVE TAPE JOINING APPARATUS USING THE SAME

摘要

An adhesive tape cutting method and an adhesive tape joining apparatus using the same are provided to extend a lifetime of a cutter blade by cutting an adhesive tape without causing a contact between an end of the cutter blade and a ring frame. A wafer supporting unit supports a semiconductor wafer(W). A frame supporting unit supports a ring frame to face the semiconductor wafer supported by the wafer supporting unit. A tape supply unit(2) supplies a ribbon-shaped supporting adhesive tape toward the ring frame. An attachment unit attaches the semiconductor wafer to the ring frame by pressing an attaching member onto a non-adhesive surface of an adhesive tape(DT). A cutting unit cuts the adhesive tape along a contour of the ring frame by tracking a reference plane of a base end of a cutter holder having a cutter blade along the surface of the adhesive tape attached to the ring frame. A removal unit removes an unnecessary part of the adhesive tape from the ring frame.