| 摘要 |
A method of manufacturing a multi-layer printed circuit board is provided to uniformly coat an insulating material by pressing after inserting prepreg between substrates. A method of manufacturing a multi-layer printed circuit board includes the steps of: forming an inner layer circuit through exposure/developing while a dry film is attached to one or both sides of a CCL(Copper Clad Laminate); forming a bump pattern through exposure/developing after laminating the dry film on the inner layer circuit; forming a bump(360) by performing copper-plating on the bump pattern; arranging a plurality of substrates with the bumps to cross each other; inserting punched prepreg(370) between the plurality of substrates; and laminating the plurality of prepreg inserted substrates by a press process.
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